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다중 공정변수를 활용한 저비용 PUF 보안 Chip의 제작
Fabrication of Low-Cost Physically Unclonable Function (PUF) Chip Using Multiple Process Variables
지홍석 ( Hong-seock Jee ) , 손돌 ( Dol Sohn ) , 연주원 ( Ju-won Yeon ) , 길태현 ( Tae-hyun Kil ) , 박효준 ( Hyo-jun Park ) , 윤의철 ( Eui-cheol Yun ) , 이문권 ( Moon-kwon Lee ) , 박준영 ( Jun-young Park )
UCI I410-151-25-02-091644477

Physically Unclonable Functions (PUFs) provide a high level of security for private keys using unique physical characteristics of hardware. However, fabricating PUF chips requires numerous semiconductor processes, leading to high costs, which limits their applications. In this work, we introduce a low-cost manufacturing method for PUF security chips. First, surface roughening through wet-etching is utilized to create random variables. Additionally, physical vapor deposition is added to further enhance randomness. After PUF chip fabrication, both Hamming distance (HD) and Hamming weight (HW) are extracted and compared to verify the fabricated chip. It is confirmed that the PUF chip using two different multiple process variables demonstrates superior uniqueness and uniformity compared to the PUF security chip fabricated using only a single process variable.

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