18.97.14.89
Join
Login
CS
한국어
ENG
Total
Title
Author
Journal
Publisher
Advanced Search
18.97.14.89
한국어
ENG
Login
Join
CS
대한금속재료학회
재료마당
차세대 반도체 방열 소재: 붕화 비소 (BAs)
차세대 반도체 방열 소재: 붕화 비소 (BAs)
김주홍 , 강준상
대한금속재료학회
2023.05
재료마당
vol. 36 iss. 3
20-30(11pages)
UCI
I410-ECN-151-24-02-088675703
Preview
₩ 5,100
More
Cite
Copy URL
Bookshelf
Preview
Abstract
expand_more
Keywords
expand_more
Table of Contents
expand_more
References (
0
)
expand_more
[자료제공 : 네이버학술정보]
Cite
KOR
ENG
Style
APA
MLA
Chicago
IEEE
Vancouver
ACS
Harvard
저자명
년도
논문명
간행물명
권호
쪽수
Style
TXT
Refworks
Mendeley
EndNote
Excel
Save
Add to Bookshelf
Add
articles to
LOGIN
Subscriber ID
ID
password
Login
Join
Find ID / PW
or
Advanced Search
˙ Keyword
All
Total
Title
Author
Journal
Publisher
Keyword
Abstract
AND
OR
NOT
Total
Title
Author
Journal
Publisher
Keyword
Abstract
˙ Subjects
Total
Humanities
Social Scienmce
Natural Science
Engineering
Medicine & Pharmacy
Marine Agriculture & Fishery
Arts & Sports
Interdisciplinary
˙ Publication Date
Total
Last Year
Custom Range
~
˙ Bibliographic Data
Articles that only provides metadata.
Exclude
Include
×
Yes
No
