오늘 하루 이 창을 열지 않음
닫기
18.97.14.83
Join
Login
CS
한국어
ENG
Total
Title
Author
Journal
Publisher
Advanced Search
18.97.14.83
한국어
ENG
Login
Join
CS
한국공업화학회
한국공업화학회 연구논문 초록집
Electrodeposition of CoWP Diffusion Barrier Layer on Cu Substrate
Electrodeposition of CoWP Diffusion Barrier Layer on Cu Substrate
윤형진 , ( Shahinoor Dulal ) , 신치범 , 김창구
한국공업화학회
2007.05
한국공업화학회 연구논문 초록집
vol. 2007
100-100(1pages)
UCI
I410-ECN-0102-2021-500-000708133
₩ 0
More
Cite
Copy URL
Bookshelf
This article is 4 pages or less.
* This article is free of use.
Abstract
expand_more
Keywords
expand_more
Table of Contents
expand_more
References (
0
)
expand_more
[자료제공 : 네이버학술정보]
Cite
KOR
ENG
Style
APA
MLA
Chicago
IEEE
Vancouver
ACS
Harvard
저자명
년도
논문명
간행물명
권호
쪽수
Style
TXT
Refworks
Mendeley
EndNote
Excel
Save
Add to Bookshelf
Add
articles to
LOGIN
Subscriber ID
ID
password
Login
Join
Find ID / PW
or
Advanced Search
˙ Keyword
All
Total
Title
Author
Journal
Publisher
Keyword
Abstract
AND
OR
NOT
Total
Title
Author
Journal
Publisher
Keyword
Abstract
˙ Subjects
Total
Humanities
Social Scienmce
Natural Science
Engineering
Medicine & Pharmacy
Marine Agriculture & Fishery
Arts & Sports
Interdisciplinary
˙ Publication Date
Total
Last Year
Custom Range
~
˙ Bibliographic Data
Articles that only provides metadata.
Exclude
Include
×
Yes
No
