The bigger size of the wafer to the meet the need of higher productivity and the smaller digital products for convene are examples of the main trends of the market among others. The higher integrity of chips is also an important task in semiconductor industry. In this thesis the COF(chop on film) technology has reviewed to investigate the best combinations of required functions and to develop a new system to save the installation area and to adapt to the variation of layout with flexibility. The new system shows the better and provides the improved safety with smaller size.