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18.97.14.87
18.97.14.87
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Regular Paper : Cure Kinetics of Cycloaliphatic Epoxy/Silica System for Electrical Insulation Materials in Outdoor Applications
( Jae Young Lee ) , ( Jae Jun Park ) , ( Jae Seol Kim ) , ( Seong Sik Shin ) , ( Chan Young Yoon ) , ( Jong Hoon Cheong ) , ( Young Woo Kim ) , ( Geun Bae Kang )
UCI I410-ECN-0102-2015-500-002037618
This article is 4 pages or less.

The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×1012 min-1, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×1012 min-1, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

1. INTRODUCTION
2. EXPERIMENTS
3. RESULTS AND DISCUSSION
4. CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
[자료제공 : 네이버학술정보]
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