18.97.14.88
Join
Login
CS
한국어
ENG
Total
Title
Author
Journal
Publisher
Advanced Search
18.97.14.88
한국어
ENG
Login
Join
CS
AI 검색 소개
대한금속재료학회
대한금속재료학회 학술대회 개요집
Cu-Sn-Cu 샌드위치 구조의 플립칩 접속부의 접속저항 및 신뢰성 (초)
Cu-Sn-Cu 샌드위치 구조의 플립칩 접속부의 접속저항 및 신뢰성 (초)
오태성 , 최정열 , 김민영 , 서광석
대한금속재료학회
2009.04
대한금속재료학회 학술대회 개요집
vol. 2009
107-107(1pages)
UCI
I410-ECN-0102-2013-580-002276048
₩ 1,000
More
Cite
Copy URL
Bookshelf
This article is 4 pages or less.
Abstract
expand_more
Keywords
expand_more
electronic packaging
flip chip
RF-SoP
contact resistance
reliability
Table of Contents
expand_more
References (
0
)
expand_more
[자료제공 : 네이버학술정보]
Cite
KOR
ENG
Citation
APA
MLA
Chicago
IEEE
Vancouver
ACS
Harvard
저자명
년도
논문명
간행물명
권호
쪽수
Download
TXT
Refworks
Mendeley
EndNote
Excel
Save
Add to Bookshelf
Add
articles to
LOGIN
Subscriber ID
ID
password
Login
Join
Find ID / PW
or
Advanced Search
˙ Keyword
All
Total
Title
Author
Journal
Publisher
Keyword
Abstract
AND
OR
NOT
Total
Title
Author
Journal
Publisher
Keyword
Abstract
˙ Subjects
Total
Humanities
Social Scienmce
Natural Science
Engineering
Medicine & Pharmacy
Marine Agriculture & Fishery
Arts & Sports
Interdisciplinary
˙ Publication Date
Total
Last Year
Custom Range
~
˙ Bibliographic Data
Articles that only provides metadata.
Exclude
Include
×
Yes
No
