18.97.14.84
18.97.14.84
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어닐링한 Cu-Ag 나노복합재 와이어의 미세조직
Microstructure of Cu-Ag Filamentary Nanocomposite Wires Annealed at Different Temperatures
곽호연 ( Ho Yeon Kwak ) , 홍순익 ( Sun Ig Hong ) , 이갑호 ( Kap Ho Lee )
UCI I410-ECN-0102-2012-550-002598778
* This article is free of use.

The microstructure of Cu-24 wt.%Ag filamentary nanocomposite fabricated by a thermo-mechanical process has been investigated by transmission electron microscopy (TEM) observations. This study is focused on the stability of Ag filaments formed by cold drawing; the effects of thermal treatment on the precipitation behavior and distribution of Ag-rich precipitates were also investigated. The Ag filaments elongated along the <111> orientation were observed in Cu-rich α phase of the as-drawn specimen and the copper matrix and the silver filament have a cube on cube orientation relationship. Annealing at temperatures lower than 200℃ for the as-drawn specimen caused insignificant change of the fibrous morphology but squiggly interfaces or local breaking of the elongated Ag filaments were easily observed with annealing at 300℃. When samples were annealed at 400℃, discontinuous precipitation was observed in supersaturated Cu solid solution. Ag precipitates with a thickness of 7-20 nm were observed along the <112> direction and the orientation relationship between the copper matrix and the Ag precipitates maintained the same orientation relationship in the as-drawn specimen. The interface between the copper matrix and the Ag precipitates is parallel to {111} and micro-twins were observed in the Ag precipitates.

[자료제공 : 네이버학술정보]
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