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18.97.9.174
한국어
ENG
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한국전기전자재료학회
ACEID `99
Poster session B : The Kffects on Solder Adhesion of Electroless Nickel and Gold with Various Condition
Poster session B : The Kffects on Solder Adhesion of Electroless Nickel and Gold with Various Condition
(Seung Jun Jung) , (Jong Eun Park) , (Soo Gil Park)
한국전기전자재료학회
1999.01
ACEID `99
vol. 1999
412-415(4pages)
UCI
I410-ECN-0102-2009-560-007521758
₩ 1,000
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