WC mono- and multilayer films were deposited on STD61 and cemented carbide substrates by Cathodic Arc Ion Plating process in various bias voltages of 0V to 200V. Chemical compositions and deposition rates were investigated using Energy Dispersive Spectroscopy(EDS) and Scanning Electron Microscopy(SEM). Microstructures of WC films were analysed by X-ray Diffractometer(XRD). The adhesion and microhardness were evaluated by Rockwell-C indentation test method, Scratch test and Microknoop hardness test. The films were formed in a mixture of α-W₂C(hexagonal structure) and β-WC(B1 NaCl structure) phase and the preferential orientation of β-WC have been changed from [311] to [220] with increasing bias voltage. The microhardness of the deposited WC films on cemented carbide were evaluated up to Hk3000 and WC multilayer films exhibited good adhesion in Rockwell-C indentation test and Scratch test.