POSTER 발표 B ( 15:30-16:30 ) : CMP 연마를 통한 STI 에서 결함 감소

A Study of Chemical Mechanical Polishing on Shallow Trench Isolation to Reduce Defect

백명기(Myoung Kee Baek),김상용(Sang Yong Kim),김창일(Chang Il Kim),장의구(Eui Goo Chang)

한국전기전자재료학회 1999.01

한국전기전자재료학회 춘계학술대회논문집 vol. 1999 501-504(4pages)

UCI I410-ECN-0102-2008-560-001243615

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