In this study, Copper film plated on PET was prepared in a hull cell plating system. In order to determine optimum temperature, it was investigated in the range of 45~75 ℃ temperature at pH 12, at bath composition CuSO₄·5H₂O/NiSO₄·6H₂O = 12.5, and in 10 min. Copper plating was performed repeatedly by an electrplating method on the copper film plated by an electroless plating method to obtain thicker copper layer for the electronic parts. Through these experiments, temperature was optimized as 60℃. The characteristics of a plated copper film was analyzed with surface roughness, hardness, thickness deviation, and crystal structure and so on.