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한국전기전자재료학회
E²M-전기 전자와 첨단 소재
패키징 재료 (2) 표면분석법을 이용한 반도체 패키지에서의 불량원인 분석
패키징 재료 (2) 표면분석법을 이용한 반도체 패키지에서의 불량원인 분석
이민우 ( Lee Min U ) , 유희열 ( Yu Hui Yeol )
한국전기전자재료학회
2003.08
E²M-전기 전자와 첨단 소재
vol. 16 iss. 8
27-43(17pages)
UCI
I410-ECN-0102-2009-560-002472665
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