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ENG
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한국전기전자재료학회
E²M-전기 전자와 첨단 소재
패키징 재료 (2) 반도체 고집적화를 위한 고분자 물질 개발 동향
패키징 재료 (2) 반도체 고집적화를 위한 고분자 물질 개발 동향
한학수 ( Han Hag Su ) , 이보영 ( Lee Bo Yeong )
한국전기전자재료학회
2003.08
E²M-전기 전자와 첨단 소재
vol. 16 iss. 8
17-26(10pages)
UCI
I410-ECN-0102-2009-560-002472670
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