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대한금속재료학회
대한금속학회회보
전자재료 심포지엄
전자재료 심포지엄
Symposium on Electronic Materials : Diffusion Barrier Properties of Chemical - Vapor - Deposited TiN Films for Cu Metallization
( Soo Hyun Kim , Deuk Seok Chung , Ki Chul Park , Seok Hong Min , Ki Bum Kim )
대한금속재료학회
1998.01
대한금속학회회보
vol. 11 iss. 5
521-529(9pages)
UCI
I410-ECN-0102-2008-580-001199565
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