플라즈마 에칭 및 PdCl2/SnCl2 촉매조건이 무전해 동도금 피막의 성능에 미치는 영향

오경화; 김동준; 김성훈

한국의류학회 한국의류학회지 플라즈마 에칭 및 PdCl2/SnCl2 촉매조건이 무전해 동도금 피막의 성능에 미치는 영향

Accredited SCOPUS

Transactions : Effect of Plasma Etching and PdCl2/SnCl2 Catalyzation on the Performance of Electroless Plated Copper Layer

오경화 ( Oh Kyung Wha ) , 김동준 ( Kim Dong Jun ) , 김성훈 ( Kim Seong Hun )

한국의류학회 2003.07

한국의류학회지 vol. 27 iss. 7 843-850(8pages)

UCI I410-ECN-0102-2009-590-003205728

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Abstract

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar>HCl>O₂〉NH₃. However, adhesion of Cu layer on PET film increased in the following order: O₂

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