In this study, SU-8 micro-molds and nickel microstructure were fabricated by UV-LIGA process. The optimum conditions for the fabrication of SU-8 micro-mold and the nickel electroforming were investigated. The 150 ㎛-thick SU-8 micro-mold was successfully fabricated through the process conditions. It was observed during electroforming that with increasing of concentration of wetting agent, the current efficiency was increased and declination of nickel microstructure thickness with change of aspect ratio was decreased. This is attributed that when adding wetting agent in electrolyte, contact angle between SU-8 micro-mold and electrolyte is decreased and penetration of electrolyte into microchannel is increased. The thickness uniformity of nickel microstructure was improved by adding wetting agent because of the improvement of secondary current density distribution.