Hot melt adhesive which is solventless type has been used widely due to the possibility of automated adhesion process. The main purpose of this study is the development of polyamide based hot melt adhesive to improve the property of conventional ethylene-vinyl acetate hot melt adhesive, which has inherent problems against creep and heat resistance. In this study, terpene resin was used as tackifier to improve adhesion and wetting properties. According to the results, the terpene resin acted as proper tackifier in this system, which decreased the melt and increased the mechanical strength of adhesive itself.