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18.97.14.91
18.97.14.91
무가압침투법에 의한 전자패키징 재료용 Al / SiCp 복합재료의 제조
Manufacturing of Al / SiCp Composites for Electronic Packaging Materials by Pressureless Infiltration
최일동 , 김성준 , 박익민 ( Il Dong Choi , Sung Joon Kim , Ik Min Park )
UCI I410-ECN-0102-2009-580-008960144

Infiltration behavior of Al-Mg alloys in SiC_p powder bed using pressureless infiltration technique have been studied. The manufacturing of Al/SiC_p composites by pressureless infiltration was successful when Mg was added over 8% in Al alloy matrix. Processing time and temperature to complete Infiltration through SiC_p bed was decreased with increasing Mg content in Al alloy. When Mg powder was added in SiC_p bed, processing temperature for successful infiltration was decreased. Volume fraction of SiC_p in composites was increased with increasing the mixing ratio of coarse SiC particles.

[자료제공 : 네이버학술정보]
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