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18.97.14.90
18.97.14.90
Rheocompocasting 한 Al-Cu-Ti / SiCp 복합재료의 조직
Microstructure of Rheocompocast Al-Cu-Ti / SiCp composite
윤여창 , 최정철 , 홍성길 ( Yeo Chang Yoon , Jung Chul Choe , Sung Kil Hong )
UCI I410-ECN-0102-2009-580-008950500

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure, of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the Al₂Cu and SiC_p is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of Al₃Ti and no exist of the SiC_p and Al₂Cu phase around the primary Al₃Ti. In the process of compositization, .SiC_p is found at the primary and final solid parts and is found at the final solid part after remelting. Al₂Cu and SiC_p are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.

[자료제공 : 네이버학술정보]
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