18.97.14.80
18.97.14.80
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Cu - Sn , Ni - Sn 계면에서 금속간화합물 형성및 Solderability 변화에 대한 연구
A Study of Intermetallic Compound Formation and Its Effects on Solderability in Ni - Sn and Cu - Sn Systems
김용혁 , 김홍석 , 이성래
UCI I410-ECN-0102-2009-580-007358524
This article is 4 pages or less.
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