Rapidly solidified Cu-based ribbons with different alloying elements were investigated to replace the conventional Ag-based filler metals. Characteristics and microstructures of the brazed joint have been studied by TEM, SEM, DTA and X-ray diffractometer. The microstructures of the melt-spun Cu-Sn-Ni-P-Si alloys were basically in amorphous state. Si additions to Cu-base alloys showed positive effect on the depression of melting point as well as on the suppression of precipitation during brazing. The results indicated that the joining characteristics of the commercialized MBF-2005 alloy could be improved by substituting silicon for phosphorus in part.