18.97.9.171
18.97.9.171
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SCIE SCOPUS
열간비틀림변형에 의한 동의 동적재결정에 관한 연구
A study on Dynamic Recrystallization of Copper by Hot Torsion
유연철(Yeon Chul Yoo), 곽흥식(H . S . Kwak)
UCI I410-ECN-0102-2008-580-001854263

The hot deformation behavior of copper has been studied in the temperature range from 0.55 Tm to 0.65 Tm and the strain rate range from 1.26×10(-3) S(-1) to 5.71×10(-3) by hot torsion. The hot softening mechanism of copper has been found to result from dynamic recrystallization through the flow curve and change of microstructure. Strain for the onset of dynamic recrystallization is represented by ε_c=0.039 LnZ-0.531 using Zener-Hollomon parameter Z and strain for the completion of dynamic recrystallization is represented by ε_x=0.276 LnZ-4.571. The time required for dynamically recrystallized grains decreased with increasing deformation temperature and strain rates. The dynamically recrystallized grains are smaller than statically recrystallized grains, and hardness is larger than statically recrystallized grains.

[자료제공 : 네이버학술정보]
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