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216.73.216.134
216.73.216.134
Chemical Vapor Deposition of Aluminum for ULSI Applications
Chemical Vapor Deposition of Aluminum for ULSI Applications
Shi Woo Rhee
UCI I410-ECN-0102-2008-570-001946022
이 자료는 4페이지 이하의 자료입니다.

Aluminum has been used widely as a conducting material in the fabrication of integrated circuits, and chemical vapor deposition process for Al has been actively investigated for the application in ultra large scale integration. In this review, various precursors, mainly alkyl aluminum and alone compounds, and reaction. mechanisms of these precursors in Al CVD are described. Epitaxial growth and selectivity of the deposition are also discussed. in addition to thermal reactions, plasma and photochemical reactions are also briefly described.

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