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KCI 우수
Boron Nitride를 함유한 열경화성 액정 에폭시의 열분해 거동
Thermal Decomposition Behavior of LCT Composites Using Boron Nitride Filler
황보세진 ( Sejin Hwangbo ) , 조승현 ( Seung Hyun Cho )
UCI I410-ECN-0102-2018-500-003857458
* 발행 기관의 요청으로 구매가 불가능한 자료입니다.

A liquid crystalline thermosetting-epoxy-based composite was fabricated using diglycidyl ether of 4,4'-biphenol, boron nitride as the filler, and sulfanilamide as the curing agent. To investigate the thermal behavior, thermogravimetric analysis was performed, and temperature differences of the sample were recorded when using 1.0-7.0 wt.% boron nitride. The activation energy for thermal decomposition was calculated using the Kissinger method and Flynn-wall method. The results showed that the activation energy was proportional to the amount of added filler.

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